Photoresist composition and method of manufacturing array substrate using the same

ABSTRACT

A photoresist composition includes a binder resin, a photo acid generator, an acryl resin having four different types of monomers, and a solvent.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.12/327,215, filed on Dec. 3, 2008, and claims the benefit of andpriority from Korean Patent Application No. 10-2008-0017354, filed Feb.26, 2008 which are both hereby incorporated by reference for all purposeas if fully set forth herein.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a photoresist composition and a methodof manufacturing an array substrate including the same. Moreparticularly, the present invention relates to a photoresist compositionused in a photolithography process to manufacture an array substrate anda method of manufacturing the array substrate.

2. Discussion of the Background

Generally, a liquid crystal display (LCD) panel includes a displaysubstrate having a thin-film transistor (TFT) as a switching devicedriving a pixel, an opposite substrate opposite the display substrate,and a liquid crystal layer between the display substrate and theopposite substrate. The light transmittance of liquid crystal includedin the LCD panel may be altered by changing a voltage applied thereto sothat the LCD panel may display an image.

The display substrate may be formed by a photolithography process usinga photoresist composition. Typically, the photolithography process is afour-mask process, which uses four masks for etching processes, so thatthe method of manufacturing the display substrate may be simple.

The exposure device used in the photolithography process may include anoptical system, and the focus of the optical system depends on adistance between the optical system and a substrate. Thus, maintaining aconstant distance between the optical system and the substrate isimportant. When the distance between the optical system and thesubstrate changes, the intensity of radiation (light energy) changes.When the intensity differs from that specified by a user, it may not bepossible to form a fine photoresist pattern on the substrate.

The photoresist pattern may not be reliably patterned due to physicalfactors such as the manufacturing precision of a stage supporting thesubstrate, vibrations when transferring the substrate, manufacturingerrors in the optical system of the exposure device, etc. Furthermore,an increased substrate size may decrease the overall reliability of thephotoresist patterning.

SUMMARY OF THE INVENTION

The present invention provides a photoresist composition that mayimprove the exposure margins and thermal resistance of a photoresistpattern including the photoresist composition.

The present invention also provides a method of manufacturing an arraysubstrate including the photoresist composition.

Additional features of the invention will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the invention

The present invention discloses a photoresist composition including abinder resin, a photo acid generator, an acryl resin represented byChemical Formula 1, and a solvent.

In Chemical Formula 1, R₁, R₂, R₃, R₄, and R₅ each represent a hydrogenatom or an alkyl group having 1-4 carbon atoms, and a, b, d, and e eachrepresent a value in a range of 0.01 to 0.99, and the sum of a, b, d ande is 1.

The present invention also discloses a method of manufacturing an arraysubstrate. A gate line and a gate electrode are formed on a basesubstrate. A gate insulation layer, an active layer, and a source metallayer are formed on the base substrate having the gate line and the gateelectrode. A photoresist film is formed by depositing the abovedescribed photoresist composition on the source metal layer. A firstphotoresist pattern is formed by patterning the photoresist film. Thefirst photoresist pattern includes a source electrode/line region havinga first thickness, a drain electrode region having the first thickness,and a channel forming region having a second thickness. The secondthickness is thinner than the first thickness. A data line and a channelportion are formed by etching the source metal layer and the activelayer using the first photoresist pattern as a mask. A secondphotoresist pattern is formed by removing the channel forming portion ofthe first photoresist pattern, and the second photoresist patternexposes a portion of the source metal layer. A source electrode and adrain electrode are formed by etching the source metal layer using thesecond photoresist pattern as a mask, and an ohmic contact pattern isformed by etching the active layer using the second photoresist patternas a mask. A pixel electrode is formed on the base substrate having thedrain electrode. The pixel electrode is connected to the drainelectrode.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate embodiments of the invention, andtogether with the description serve to explain the principles of theinvention.

FIG. 1 is a plan view showing an array substrate according to anexemplary embodiment of the present invention.

FIG. 2, FIG. 3, FIG. 4, FIG. 5, FIG. 6, FIG. 7, and FIG. 8 arecross-sectional views showing a method of manufacturing the arraysubstrate of FIG. 1.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

The invention is described more fully hereinafter with reference to theaccompanying drawings, in which embodiments of the invention are shown.This invention may, however, be embodied in many different forms andshould not be construed as limited to the embodiments set forth herein.Rather, these embodiments are provided so that this disclosure will bethorough and complete, and will fully convey the scope of the inventionto those skilled in the art. In the drawings, the size and relativesizes of layers and regions may be exaggerated for clarity.

It will be understood that when an element or layer is referred to asbeing “on,” “connected to,” or “coupled to” another element or layer, itcan be directly on, connected or coupled to the other element or layeror intervening elements or layers may be present. In contrast, when anelement is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. Like numbers refer to likeelements throughout. As used herein, the term “and/or” includes any andall combinations of one or more of the associated listed items.

It will be understood that, although the terms first, second, third,etc. may be used herein to describe various elements, components,regions, layers, and/or sections, these elements, components, regions,layers, and/or sections should not be limited by these terms. Theseterms are only used to distinguish one element, component, region,layer, or section from another region, layer, or section.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a,” “an,” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

Embodiments of the invention are described herein with reference tocross-section illustrations that are schematic illustrations ofidealized embodiments (and intermediate structures) of the invention. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, embodiments of the invention should not be construed aslimited to the particular shapes of regions illustrated herein but areto include deviations in shapes that result, for example, frommanufacturing. For example, an implanted region illustrated as arectangle will, typically, have rounded or curved features and/or agradient of implant concentration at its edges rather than a binarychange from implanted to non-implanted region. Likewise, a buried regionformed by implantation may result in some implantation in the regionbetween the buried region and the surface through which the implantationtakes place. Thus, the regions illustrated in the figures are schematicin nature and their shapes are not intended to illustrate the actualshape of a region of a device and are not intended to limit the scope ofthe invention.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

Photoresist Composition

A photoresist composition according to an exemplary embodiment of thepresent invention includes a binder resin, a photo acid generator, anacryl resin represented by Chemical Formula 1, and a solvent.

In Chemical Formula 1, R₁, R₂, R₃, R₄, and R₅ each represent a hydrogenatom or an alkyl group having 1-4 carbon atoms, and a, b, d, and e eachrepresent a value in a range of about 0.01 to about 0.99, and the sum ofa, b, d, and e is 1.

Hereinafter, components of the photoresist composition according to anexemplary embodiment of the present invention will be described.

The binder resin may be soluble in an alkali solution. For example, thebinder resin may be prepared by reacting a phenol compound with analdehyde compound in the presence of an acidic catalyst. A content ofthe binder resin may be about 1% to about 50% by weight of thephotoresist composition.

Examples of the phenol compound may include phenol, o-cresol, m-cresol,p-cresol, 2,3-dimethylphenol, 3,4-dimethylphenol, 3,5-dimethylphenol,2,4-dimethylphenol, 2,6-dimethylphenol, 2,3,6-trimethylphenol,2-t-butylphenol, 3-t-butylphenol, 4-t-butylphenol, 2-methylresorcinol,4-methylresorcinol, 5-methylresorcinol, 4-t-butylcatechol,2-methoxyphenol, 3-methoxyphenol, 2-propylphenol, 3-propylphenol,4-propylphenol, 2-isopropylphenol, 2-methoxy-5-methylphenol,2-t-butyl-5-methylphenol, thymol, and isothymol. These may be used aloneor in combinations. In some exemplary embodiments of the presentinvention, a mixture of m-cresol and p-cresol may be used as the phenolcompound to control the sensitivity of the photoresist composition. Inone exemplary embodiment, a weight ratio of m-cresol to p-cresol may bein a range of about 80:20 to about 20:80. In another exemplaryembodiment, the weight ratio may be in a range of about 70:30 to about50:50.

Examples of the aldehyde compound may include formaldehyde, formalin,p-formaldehyde, trioxane, acetaldehyde, benzaldehyde,phenylacetaldehyde, α-phenylpropylaldehyde, β-phenylpropylaldehyde,o-hydroxybenzaldehyde, m-hydroxybenzaldehyde, p-hydroxybenzaldehyde,o-chlorobenzaldehyde, m-chlorobenzaldehyde, p-chlorobenzaldehyde,o-methylbenzaldehyde, m-methylbenzaldehyde, p-methylbenzaldehyde,p-ethylbenzaldehyde, p-n-butylbenzaldehyde, and terephthalic acidaldehyde. These may be used alone or in combinations.

When the content of the binder resin includes less than about 1% byweight of the photoresist composition, the viscosity of the photoresistcomposition may be excessively low such that the photoresist compositiondoes not form a fine photoresist pattern having a designated thickness.When the content of the binder resin is greater than about 50% by weightof photoresist composition, the viscosity of the photoresist compositionmay be excessively high such that the photoresist composition may not becoated on a substrate. Thus, in some exemplary embodiments, the contentof the binder resin may be about 1% to about 50% by weight of thephotoresist composition.

The photo acid generator is provided with light to generate an acid,such as Bronsted acid or Lewis acid. Examples of the photo acidgenerator may include an onium salt, a halogenated organic compound, aquinone diazide compound, a bis(sulfonyl)diazomethane compound, asulfone compound, an organic acid-ester compound, an organic acid-amidecompound, and an organic acid-imide compound. These may be used alone orin combinations.

Examples of the onium compound may include a diazonium salt, an ammoniumsalt, an iodonium salt (e.g., diphenyliodonium triflate), a sulfoniumsalt (e.g., triphenylsulfonium triflate), a phosphonium salt, anarsonium salt, and an oxonium salt. These may be used alone or incombinations.

Examples of the halogenated organic compound may include ahalogen-containing oxadiazole compound, a halogen-containing triazinecompound, a halogen-containing triazine compound, a halogen-containingacetophenone compound, a halogen-containing benzophenone compound, ahalogen-containing sulfoxide compound, a halogen-containing sulfoniccompound, a halogen-containing thiazole compound, a halogen-containingoxazole compound, a halogen-containing triazole compound, ahalogen-containing 2-pyrone compound, a halogen-containing heterocycliccompound, a halogen-containing aliphatic hydrocarbon, ahalogen-containing aromatic hydrocarbon, and a sulfenyl halide compound.These may be used alone or in combinations.

Particularly, examples of the halogenated organic compound may includetris(2,3-dibromopropyl)phosphate,tris(2,3-dibromo-3-chloropropyl)phosphate, tetrabromochlorobutane,2-[2-(3,4-dimethoxyphenyl)ethenyl]-4,6-bis(trichloromethyl)-S-triazine,hexachlorobenzene, hexabromobenzene, hexabromocyclododecane,hexabromocyclododecene, hexabromobiphenyl, allyltribromophenylether,tetrachlorobisphenol A, tetrabromobisphenol A, bis(chloroethyl)ether oftetrachlorobisphenol A, tetrachlorobisphenol S, tetrabromobisphenol S,bis(2,3-dichloropropyl)ether of tetrachlorobisphenol A,bis(2,3-dibromopropyl)ether of tetrabromobisphenol A,bis(chloroethyl)ether of tetrachlorobisphenol S, bis(bromoethyl)ether oftetrabromobisphenol S, bis(2,3-dichloropropyl)ether of bisphenol S,bis(2,3-dibromopropyl)ether of bisphenol S,tris(2,3-dibromopropyl)isocyanurate,2,2-bis(4-hydroxy-3,5-dibromophenyl)propane,2,2-bis(4-(2-hydroxyethoxy)-3,5-dibromophenyl)propane,dichlorodiphenyltrichloroethane, pentachlorophenol,2,4,6-trichlorophenyl-4-nitrophenylether, 4,5,6,7-tetrachlorophthalide,1,1-bis(4-chlorophenyl)ethanol,1,1-bis(4-chlorophenyl)-2,2,2-trichloroethanol,2,4,4′,5-tetrachlorodiphenylsulfide, and2,4,4′,5-tetrachlorodiphenylsulfone. These may be used alone or incombinations.

Examples of the quinone diazide compound may include a sulfonic acidester of a quinone diazide derivative such as1,2-benzoquinonediazide-4-sulfonic acid ester,1,2-naphthoquinonediazide-4-sulfonic acid ester, a sulfonic acidchloride of a quinone diazide derivative such as1,2-benzoquinone-2-diazide-4-sulfonic acid chloride,1,2-naphthoquinone-2-diazide-4-sulfonic acid chloride,1,2-naphthoquinone-2-diazide-5-sulfonic acid chloride,1,2-naphthoquinone-1-diazide-6-sulfonic acid chloride, or1,2-benzoquinone-1-diazide-5-sulfonic acid chloride. These may be usedalone or in combinations.

Examples of the bis(sulfonyl)diazomethane compound may includeα,α′-bis(sulfonyl)diazomethane containing an alkyl group, an alkenylgroup, an aralkyl group, an aromatic group, and a heterocyclic group,which may be symmetrically substituted, non-symmetrically substituted,or unsubstituted. These may be used alone or in combinations.

Examples of the sulfone compound may include a sulfone compound and adisulfone compound, which contains an alkyl group, an alkenyl group, anaralkyl group, an aromatic group, and a heterocyclic group, which may besymmetrically substituted, non-symmetrically substituted, orunsubstituted. These may be used alone or in combinations.

Examples of the organic acid ester may include carboxylic acid ester,sulfonic acid ester, and phosphoric acid ester. Examples of the organicacid amide may include carboxylic acid amide, sulfonic acid amide, andphosphoric acid amide. Examples of the organic acid imide may includecarboxylic acid imide, sulfonic acid imide, and phosphoric acid imide.These may be used alone or in combinations.

Moreover, examples of the photo acid generator may further includecyclohexylmethyl(2-oxocyclohexyl)sulfonium trifluoromethane sulfonate,dicyclohexylmethyl(2-oxocyclohexyl)sulfonium trifluoromethane sulfonate,2-oxocyclohexyl(2-norbornyl)sulfonium trifluoromethane sulfonate,2-cyclohexylsulfonylcyclohexanone, dimethyl(2-oxocyclohexyl)sulfoniumtrifluoromethane sulfonate, triphenylsulfonium trifluoromethanesulfonate, diphenyliodonium trifluoromethane sulfonate,N-hydroxysuccinimidyl trifluoromethane sulfonate, phenyl p-toluenesulfonate, and α-carbonyl-α-sulfonyldiazomethane containing an alkylgroup, an alkenyl group, an aralkyl group, an aromatic group, or aheterocyclic group, which may be symmetrically substituted,non-symmetrically substituted, or unsubstituted. These may be used aloneor in combinations.

When a content of the photo acid generator is less than about 1% byweight of the photoresist composition, a photoresist pattern formed fromthe photoresist composition may not be clear since the amount of acidgenerated by light exposure may not be sufficient. When the content ofthe photo acid generator is greater than about 20% by weight of thephotoresist composition, a photoresist pattern formed from thephotoresist composition may have a round edge or may be damaged in thecourse of a development process. Thus, in some exemplary embodiments,the content of the photo acid generator may be about 1% to about 20% byweight of the photoresist composition.

The acryl resin represented by Chemical Formula 1 may be prepared bycopolymerizing four different types of monomers.

For example, R₁, R₂, R₃, R₄, and R₅ in Chemical Formula 1 may eachrepresent any one of a hydrogen atom, a methyl group, an ethyl group, abutyl group, and a propyl group.

Each of a, b, d, and e represent a value in a range of about 0.01 toabout 0.99, and the sum of a, b, d, and e is 1. For example, in ChemicalFormula 1, a may be about 0.5 to about 0.6, b may be about 0.25 to 0.35,d may be about 0.05 to about 0.15, and e may be about 0.01 to about 0.1.

In one exemplary embodiment, the acryl resin may be represented by thefollowing Chemical Formula 2.

When the content of the acryl resin is less than about 1% by weight ofthe photoresist composition, the acryl resin may not improve theexposure margins and the thermal resistance of the photoresist patternformed using the photoresist composition. When the content of the acrylresin is greater than about 20% by weight of the photoresistcomposition, the adhesion of the photoresist pattern and the substratemay be low and a residual pattern of the photoresist pattern may not beformed on the substrate. Thus, in some exemplary embodiments, thecontent of the acryl resin may be about 1% to about 20% by weight of thephotoresist composition.

A weight average molecular weight of the acryl resin may be about 5,000to 30,000. The weight average molecular weight denotes apolystyrene-reduced weight-average molecular weight measured by gelpermeation chromatography (GPC). When the weight average molecularweight of the acryl resin is less than about 5,000, the acryl resin maynot improve the exposure margins and the thermal resistance of thephotoresist pattern. When the weight average molecular weight of theacryl resin is greater than about 30,000, the acryl resin may be notsoluble in the solvent. In exemplary embodiments, the weight averagemolecular weight of the acryl resin may be about 16,000.

Examples of the solvent may include alcohols such as methanol andethanol, ethers such as tetrahydrofurane, glycol ethers such as ethyleneglycol monomethyl ether and ethylene glycol monoethyl ether, ethyleneglycol alkyl ether acetates such as methyl cellosolve acetate and ethylcellosolve acetate, diethylene glycols such as diethylene glycolmonomethyl ether, diethylene glycol monoethyl ether, and diethyleneglycol dimethyl ether, propylene glycol monoalkyl ethers such aspropylene glycol methyl ether, propylene glycol ethyl ether, propyleneglycol propyl ether, and propylene glycol butyl ether, propylene glycolalkyl ether acetates such as propylene glycol methyl ether acetate,propylene glycol ethyl ether acetate, propylene glycol propyl etheracetate, and propylene glycol butyl ether acetate, propylene glycolalkyl ether propionates such as propylene glycol methyl etherpropionate, propylene glycol ethyl ether propionate, propylene glycolpropyl ether propionate, and propylene glycol butyl ether propionate,aromatic compounds such as toluene and xylene, ketones such as methylethyl ketone, cyclohexanone, and 4-hydroxy-4-methyl-2-pentanone, andester compounds such as methyl acetate, ethyl acetate, propyl acetate,butyl acetate, ethyl 2-hydroxypropionate, methyl 2-hydroxy-2-methylpropionate, ethyl 2-hydroxy-2-methyl propionate, methyl hydroxyacetate,ethyl hydroxyacetate, butyl hydroxyacetate, methyl lactate, ethyllactate, propyl lactate sulfate, butyl lactate, methyl3-hydroxypropionate, ethyl 3-hydroxypropionate, propyl3-hydroxypropionate, butyl 3-hydroxypropionate, methyl2-hydroxy-3-methyl butanoate, methyl methoxy acetate, ethyl methoxyacetate, propyl methoxy acetate, butyl methoxy acetate, methyl ethoxyacetate, ethyl ethoxy acetate, propyl ethoxy acetate, butyl ethoxyacetate, methyl propoxy acetate, ethyl propoxy acetate, propyl propoxyacetate, butyl propoxy acetate, methyl butoxy acetate, ethyl butoxyacetate, propyl butoxy acetate, butyl butoxy acetate, methyl2-methoxypropionate, ethyl 2-methoxypropionate, propyl2-methoxypropionate, butyl 2-methoxypropionate, methyl2-ethoxypropionate, ethyl 2-ethoxypropionate, propyl 2-ethoxypropionate,butyl 2-ethoxypropionate, methyl 2-butoxypropionate, ethyl2-butoxypropionate, propyl 2-butoxypropionate, butyl 2-butoxypropionate,methyl 3-methoxypropionate, ethyl 3-methoxypropionate, propyl3-methoxypropionate, butyl 3-methoxypropionate, methyl3-ethoxypropionate, ethyl 3-ethoxypropionate, propyl 3-ethoxypropionate,butyl 3-ethoxypropionate, methyl 3-propoxypropionate, ethyl3-propoxypropionate, propyl 3-propoxypropionate, butyl3-propoxypropionate, methyl 3-butoxypropionate, ethyl3-butoxypropionate, propyl 3-butoxypropionate, and butyl3-butoxypropionate. These may be used alone or in combinations.

In some exemplary embodiments, the photoresist composition may furtherinclude a hydroxyl phenol derivative represented by Chemical Formula 3.

In Chemical Formula 1, R₆, R₇, and R₈ each represent an alkyl grouphaving 1-3 carbon atoms. R₆, R₇, and R₈ may include a methyl group, anethyl group, and a propyl group. In one exemplary embodiment, R₆, R₇,and R₈ may each represent a methyl group.

If the photoresist composition further includes a hydroxyl phenolderivative, the exposure margins and the thermal resistance of thephotoresist pattern may be more improved.

When the content of the hydroxyl phenol derivative is less than about 1%by weight of the photoresist composition, the hydroxyl phenol derivativemay not improve the exposure margins and the thermal resistance of thephotoresist pattern. When the content of the hydroxyl phenol derivativeis greater than about 10% by weight of the photoresist composition, thecontent of the binder resin and the acryl resin is relatively small sothat control of the exposure margins and a shape control of thephotoresist pattern may be difficult. Thus, in exemplary embodiments,the content of the hydroxyl phenol derivative may be about 1% to about10% by weight of the photoresist composition.

In addition, in some exemplary embodiments, the photoresist compositionfurther includes additives such as an adhesion promotion agent, asurfactant, an acid diffusion suppressant, and a dye. The content of theadditives may be about 1% to about 10% by weight of the photoresistcomposition.

The adhesion promotion agent may improve an adhesion between a substrateand a photoresist pattern formed from the photoresist composition.Examples of the adhesion promotion agent may include a silane couplingagent containing a reactive substitution group such as a carboxyl group,a methacrylic group, an isocyanate group, or an epoxy group.Particularly, examples of the silane coupling agent may includeγ-methacryloxypropyl trimethoxy silane, vinyl triacetoxy silane, vinyltrimethoxy silane, γ-isocyanate propyl triethoxy silane, γ-glycidoxypropyl trimethoxy silane, and β-(3,4-epoxy cyclohexyl)ethyl trimethoxysilane. These may be used alone or in combinations.

The surfactant may improve coating characteristics and developmentcharacteristics of the photoresist composition. Examples of thesurfactant may include polyoxyethylene octylphenylether, polyoxyethylenenonylphenylether, F171, F172, F173 (trade name, manufactured byDainippon Ink in Japan), FC430, FC431 (trade name, manufactured bySumitomo 3M in Japan), and KP341 (trade name, manufactured by Shin-EtsuChemical in Japan). These may be used alone or in combinations.

The acid diffusion suppressant may prevent an acid from diffusing intoan area that is not exposed to light. Examples of the photosensitizermay include an amine, ammonium hydroxide, and a photosensitive base.Particularly, examples of acid diffusion suppressant may includetetrabutylammonium hydroxide, triethanolamine, diethanolamine,trioctylamine, n-octylamine, trimethylsulfonium hydroxide, andtriphenylsulfonium hydroxide. These may be used alone or incombinations.

The dye may serve to control the contrast of a photoresist pattern. Thedye may be selected in view of solubility and heat resistance. Examplesof the dye may include a pyrazoleazo-based dye, an anilinoazo-based dye,an arylazo-based dye, a triphenylmethane-based dye, ananthraquinone-based dye, an anthrapyridone-based dye, abenzylidene-based dye, an oxonol-based dye, a pyrazoletriazoleazo-baseddye, a pyridoneazo-based dye, a cyanine-based dye, a phenothiazine-baseddye, a pyrrolopyrazoleazomethine-based dye, a xanthene-based dye, aphthalocyanine-based dye, a benzopyran-based dye, and an indigo-baseddye. These may be used alone or in combinations.

According to the above, a photoresist composition may not be affected asmuch by changes in the depth of focus (DOF) of an optical system. TheDOF may be defined by a distance capable of forming a fine photoresistpattern, the distance between the optical system of the exposure deviceand the substrate. This increases a range of forming a fine photoresistpattern. Although a distance between the optical system of an exposuredevice and a substrate changes so the focus of the optical systemchanges, the photoresist composition may still form a fine photoresistpattern. Therefore, forming a photoresist pattern using the photoresistcomposition may not be affected by the focus of the optical system,which may vary due to physical factors such as the manufacturingprecision of a stage supporting the substrate, vibrations whentransferring the substrate, and manufacturing errors in the opticalsystem of the exposure device. Thus, the exposure margins of thephotoresist pattern may be improved.

Furthermore, the thermal resistance of the photoresist pattern may beimproved, and the reliability of manufacturing a thin-film transistor(TFT) by the four-mask process may be improved.

Hereinafter, a method of manufacturing an array substrate according toan exemplary embodiment of the present invention will be described morefully with reference to the accompanying drawings.

Method of Manufacturing an Array Substrate

FIG. 1 is a plan view showing an array substrate according to anexemplary embodiment of the present invention. FIG. 2, FIG. 3, FIG. 4,FIG. 5, FIG. 6, FIG. 7, and FIG. 8 are cross-sectional views showing amethod of manufacturing the array substrate of FIG. 1. Particularly,FIG. 2, FIG. 3, FIG. 4, FIG. 5, FIG. 6, FIG. 7, and FIG. 8 respectivelyshow a cross-section taken along line I-I′ of FIG. 1.

Referring to FIG. 1 and FIG. 2, a gate metal layer (not shown) is formedon a base substrate 110, and then the gate metal layer is patternedthrough a photolithography process using a first exposure mask (notshown) to form a gate pattern 120.

The gate pattern 120 includes a gate line 122 and a gate electrode 124connected to the gate line 122. The gate line 122 may extend in onedirection on the base substrate 110, and a plurality of the gate lines122 may be arranged parallel to each other. The gate electrode 124 isconnected to the gate line 122 and serves as a gate terminal of a TFTfor a switching device formed in a pixel P.

The base substrate 110 may be a transparent insulation substrate. Anexample of a material that may be used for the base substrate 110 isglass.

For example, the gate metal layer may be formed by a sputtering processon the base substrate 110. The gate pattern 120 may be formed by wetetching process. Examples of a material that may be used for the gatepattern 120 may include aluminum (Al), molybdenum (Mo), neodymium (Nd),chromium (Cr), tantalum (Ta), titanium (Ti), tungsten (W), copper (Cu),silver (Ag), or an alloy thereof. The gate pattern 120 may have adouble-layer structure including at least two metal layers havingdifferent physical characteristics. For example, the gate pattern 120may have an Al/Mo double-layer structure including an Al layer and a Molayer so as to reduce resistance.

Referring to FIG. 3, a gate insulation layer 130 and an active layer 140are sequentially formed on the base substrate 110 having the gatepattern 120. The gate insulation layer 130 and the active layer 140 maybe formed by plasma-enhanced chemical vapor deposition (PECVD) in oneexemplary embodiment.

The gate insulation layer 130 may protect and insulate the gate pattern120. Examples of a material that may be used for the gate insulationlayer 130 may include silicon nitride and silicon oxide. For example, athickness of the gate insulation layer 130 may be about 4,500 Å.

The active layer 140 includes a semiconductor layer 142 and an ohmiccontact layer 144. An example of a material that may be used for thesemiconductor layer 142 may is amorphous silicon, and an examples of amaterial that may be used for the ohmic contact layer 144 is amorphoussilicon into which n⁺ impurities are implanted at a high concentration.

A source metal layer 150 is formed on the active layer 140. In oneexample, the source metal layer 150 may have a Mo/Al/Mo triple-layerstructure to reduce the resistance of the source metal layer 150.Alternatively, the source metal layer 150 may have a single layerincluding Mo or Al.

Referring to FIG. 4, a photoresist composition is coated on the sourcemetal layer 150 to form a photoresist film (not shown). The photoresistfilm is exposed to light by a second exposure mask (not shown), such asa slit mask or a halftone mask, and then developed to form a firstphotoresist pattern 160.

The photoresist composition includes a binder resin, a photo acidgenerator, an acryl resin represented by Chemical Formula 1, and asolvent.

In Chemical Formula 1, R₁, R₂, R₃, R₄, and R₅ each represent a hydrogenatom or an alkyl group having 1-4 carbon atoms, and a, b, d, and e eachrepresent a value in a range of about 0.01 to about 0.99, and the sum ofa, b, d, and e is 1.

The photoresist composition is substantially the same composition as inexemplary embodiments of the present invention described above. Thus,any further description will be omitted.

The first photoresist pattern 160 includes a source electrode/lineregion having a first thickness, a drain electrode region having thefirst thickness, and a channel forming region having a second thickness.The channel forming region is formed on a channel forming area CR of thebase substrate 110. The second thickness is thinner than the firstthickness. The channel forming region of the first photoresist pattern160 is formed by partially exposing light through a slit portion or ahalftone portion of the first exposure mask. After the source metallayer 150 is etched using the first photoresist pattern 160, a remainingsource metal layer forms a source electrode (157, see FIG. 7) and asource line (155, see FIG. 5) under the source electrode/line region ofthe first photoresist pattern 160 and a drain electrode (158, see FIG.7) under the drain electrode region of the first photoresist pattern160.

Referring to FIG. 1 and FIG. 5, the source metal layer 150 is etchedusing the first photoresist pattern as etching preventing layer. Forexample, the source metal layer 150 may be etched by a wet etchingprocess.

After the source metal layer 150 is etched by the wet etching processusing the first photoresist pattern 160, the source line 155 and asource/drain metal pattern 156 remain on the base substrate 110. Thesource line 155 may extend parallel to the gate line 122 on the basesubstrate 110, and a plurality of the source lines 155 may be arrangedparallel each other. Since the source metal layer 150 is etched by thewet etching process, an edge of the source line 155 and an edge of thesource/drain metal pattern 156 may coincide with an edge of the firstphotoresist pattern 160 to form an undercut having a width Δd.

Thereafter, the active layer 140 is etched using the first photoresistpattern 160 as an etching prevention mask. For example, the active layer140 may be etched by a dry etching process. After the active layer 140is etched, a remaining semiconductor layer 142 forms a channel portion(146, see FIG. 7) and a remaining ohmic contact layer 144 forms a pairof ohmic contact patterns (148, see FIG. 7).

Referring to FIG. 5 and FIG. 6, a second photoresist pattern 162 isformed by removing the channel forming region forming on the channelforming area CR. Thus, the source/drain metal pattern 156 forming on thechannel forming area CR is exposed through the second photoresistpattern 162.

Alternatively, the active layer 140 may be etched after the secondphotoresist pattern 162 is formed. Thus, the active layer 140 may beetched using the source/drain metal pattern 156 and the secondphotoresist pattern 162 as an etching prevention mask.

Referring to FIG. 1 and FIG. 7, the source electrode 157 and the drainelectrode 158 are formed by etching the source/drain metal pattern 156formed on the channel forming area CR and exposed through the secondphotoresist pattern 162. For example, the source/drain metal pattern 156may be etched by a wet etching process.

The source electrode 157 is connected to the source line 155, and servesas a source terminal of the TFT. The drain electrode 158 is spaced apartfrom the source electrode 157 and serves as a drain terminal of the TFT.

Thereafter, an exposed portion of the ohmic contact layer 144 is etchedusing the second photoresist pattern 162 as a mask to form a pair ofohmic contact patterns 148. The exposed portion of the ohmic contactlayer 144 is a portion of the ohmic contact layer 144 formed on thechannel forming area CR of the base substrate 110. The ohmic contactpatterns 148 are spaced apart from each other. The second photoresistpattern 162 is removed from the base substrate 110. For example, thesecond photoresist pattern 162 may be removed by a stripping processusing a stripping solution. Thus, the TFT having a channel is formed onthe base substrate 110. The channel may be a portion between the sourceelectrode 157 and the drain electrode 158, and the channel is formed onthe channel forming area CR of the base substrate 110.

Referring to FIG. 1 and FIG. 8, a passivation layer 170 is formed on thebase substrate 110 having the TFT. The passivation layer 170 protectsand insulates the TFT and the data line 155. Examples of a material thatmay be used for the passivation layer 170 may include silicon nitride,silicon oxide, etc. For, example, the passivation layer 170 may beformed through a chemical vapor deposition (CVD) method, and a thicknessof the passivation layer 170 may be about 500 Å to about 2,000 Å.

The passivation layer 170 is patterned through a photolithographyprocess using a third exposure mask (not shown) to form a contact hole172 exposing a portion of the drain electrode 158.

After the contact hole 172 is formed, a transparent conductive layer isformed on the passivation layer 170. The transparent conductive layer ispatterned through a photolithography process using a fourth exposuremask (not shown) to form a pixel electrode 180 in the pixel P. The pixelelectrode 180 is connected to the drain electrode 158 through thecontact hole 172. Examples of a material that may be used for the pixelelectrode 180 may include indium zinc oxide (IZO) and indium tin oxide(ITO).

Alternatively, before the pixel electrode 180 is formed, an organicinsulation layer (not shown) may be formed on the passivation layer 170to planarize the base substrate 110.

The photoresist composition and the method of manufacturing an arraysubstrate according to exemplary embodiments of the present inventionwill be further described hereinafter through Examples and ComparativeExamples.

Preparation of a Photoresist Composition

EXAMPLE 1

A phenol mixture including m-cresol and p-cresol in a weight ratio ofabout 50:50 was reacted with formaldehyde to prepare a novolak resin asa binder resin, of which a weight average molecular weight was about8,000. About 2% by weight of an acryl resin represented by ChemicalFormula 3, about 8% by weight of the binder resin, about 5% by weight of1,2-naphtoquinondiazide-4-sulfonic ester as a photo acid generator, andabout 85% by weight of propylene glycol methyl ether acetate as asolvent were mixed with each other to prepare a photoresist composition.

EXAMPLE 2

A phenol mixture including m-cresol and p-cresol in a weight ration ofabout 50:50 was reacted with formaldehyde to prepare a novolak resin asa binder resin, of which a weight average molecular weight was about8,000. About 2% by weight of an acryl resin represented by ChemicalFormula 3, about 2% by weight of a hydroxyl phenol derivate representedby Chemical Formula 4, about 8% by weight of the binder resin, about 5%by weight of 1,2-naphtoquinondiazide-4-sulfonic ester as a photo acidgenerator, and about 83% by weight of propylene glycol methyl etheracetate as a solvent were mixed with each other to prepare a photoresistcomposition.

COMPARATIVE EXAMPLE 1

A phenol mixture including m-cresol and p-cresol in a weight ration ofabout 50:50 was reacted with formaldehyde to prepare a novolak resin asa binder resin, of which a weight average molecular weight was about8,000. About 10% by weight of the binder resin, about 5% by weight of1,2-naphtoquinondiazide-4-sulfonic ester as a photo acid generator, andabout 85% by weight of propylene glycol methyl ether acetate as asolvent were mixed with each other to prepare a photoresist composition.

Evaluation of a Photoresist Pattern Formed Using a PhotoresistComposition

The compositions prepared in Examples 1 and 2 and Comparative Example 1were each spread on a substrate to form a photoresist film. A mask wasdisposed on the photoresist film, and the photoresist film was exposedby ultra violet light in changing focus of an optical system of anexposure device.

After an exposed photoresist film was developed using an alkali solutionand baked on high temperature so that a photoresist pattern was formedon the substrate, a shape of the photoresist pattern was observedthrough an electron microscope. The obtained results are shown in Table1 and Table 2.

TABLE 1 Depth of Focus (DOF) Example 1 About 20 μm Example 2 About 25 μmComparative Example 1 About 15 μm

TABLE 2 Breakdown temperature of a photoresist pattern Example 1 Overabout 130° C. Example 2 Over about 135° C. Comparative Example 1 Overabout 120° C.

The DOF may be defined by a distance capable of forming a finephotoresist pattern, the distance between the optical system of theexposure device and the substrate. In Table 1, the DOF represents amaximum of the distance.

Referring to Table 1, a DOF of the photoresist pattern according toExample 1 is about 20 μm, a DOF of the photoresist pattern according toExample 2 is about 25 μm, and a DOF of the photoresist pattern accordingto Comparative Example 1 is about 15 μm. Although a focus of the opticalsystem is changed, the range of forming the fine photoresist pattern iswide. Therefore, forming the photoresist pattern including thephotoresist composition may not depend on the focus of the opticalsystem, which is changed by physical factors such as the manufacturingprecision of a stage supporting the substrate, vibrations whentransferring the substrate, and manufacturing errors of the opticalsystem of the exposure device.

Referring to Table 2, a breakdown temperature of a photoresist patternaccording to Example 1, which includes the acryl resin represented byChemical Formula 3, is higher than a breakdown temperature of aphotoresist pattern according to Comparative Example 1, which does notinclude the acryl resin. In other words, a thermal resistance of thephotoresist pattern according to Example 1 is better than a thermalresistance of the photoresist pattern according to Comparative Example1.

Moreover, a breakdown temperature of a photoresist pattern according toExample 2, which further includes the hydroxyl phenol derivativerepresented by Chemical Formula 4, is higher than the breakdowntemperatures of the photoresist patterns according to Example 1 andComparative Example 1.

It will be apparent to those skilled in the art that variousmodifications and variation can be made in the present invention withoutdeparting from the spirit or scope of the invention. Thus, it isintended that the present invention cover the modifications andvariations of this invention provided they come within the scope of theappended claims and their equivalents.

What is claimed is:
 1. A photoresist composition, comprising: a binderresin; a photo acid generator; an acryl resin represented by ChemicalFormula 1; and a solvent,

wherein R₁, R₂, R₃, R₄, and R₅ each represent a hydrogen atom or analkyl group having 1-4 carbon atoms, and a, b, d, and e each represent avalue in a range of about 0.01 to about 0.99, and the sum of a, b, d,and e is
 1. 2. The photoresist composition of claim 1, wherein a isabout 0.5 to about 0.6, b is about 0.25 to about 0.35, d is about 0.05to about 0.15, and e is about 0.01 to about 0.1.
 3. The photoresistcomposition of claim 2, wherein the acryl resin is represented byChemical Formula 2,


4. The photoresist composition of claim 1, wherein a content of theacryl resin is about 1% to about 20% by weight of the photoresistcomposition.
 5. The photoresist composition of claim 4, wherein acontent of the binder resin is about 1% to about 50% by weight of thephotoresist composition.
 6. The photoresist composition of claim 4,wherein a content of the photo acid generator is about 1% to about 20%by weight of the photoresist composition.
 7. The photoresist compositionof claim 1, further comprising a hydroxyl phenol derivative beingrepresented by Chemical Formula 3,

wherein R₆, R₇, and R₈ each represent an alkyl group having 1-3 carbonatoms.
 8. The photoresist composition of claim 7, wherein R₆, R₇, and R₈each represent a methyl group.
 9. The photoresist composition of claim7, wherein a content of the hydroxyl phenol derivative is about 1% toabout 10% by weight of the photoresist composition.
 10. The photoresistcomposition of claim 1, wherein a weight average molecular weight of theacryl resin is about 5,000 to about 30,000.
 11. The photoresistcomposition of claim 1, further comprising an additive, the additivecomprising at least one of a dye, an adhesion promoter, and an aciddiffusion inhibitor.
 12. The photoresist composition of claim 1, whereina is about 0.55, b is about 0.3, d is about 0.1, and e is about 0.05.13. The photoresist composition of claim 1, wherein the binder resin iscross-linked.
 14. The photoresist composition of claim 1, wherein thebinder resin comprises a phenol compound reacted with an aldehydecompound in the presence of an acidic catalyst.